Polyamide amber hotmelt adhesive for molding applications. Bond area sets into thermoplastic condition.
TECHNOMELT® PA 641 is an amber polyamide hotmelt adhesive for molding applications. With an application temperature of +392 °F to +464 °F (+200 °C to +240 °C), a physical setting cure leads to a thermoplastic condition of the bond area. The product resists temperature to a softening point of +338 °F to +356 °F (+170 °C to +180 °C). Creep resistance temperature is +311 °F (+155 °C).
- Purpose-designed for molding applications